Difference between revisions of "Published Papers"

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Below is a list of published works citing Hyrel equipment.  
Below is a list of published works citing Hyrel equipment.  


<span style="color: red;">The pages about '''Unheated or Chilled Reservoir Printing''', also known as '''Robocasting''' or '''DIW''' (Direct Ink Writing), '''SEP''' (Semisolid Extrusion Printing), '''SSE''' (Semisolid Extrusion). '''3DCP''' (3D Concrete Printing), or '''DCC''' (Digital Concrete Construction), ran too long, and have been split off to the new '''[[Published_Papers_(DIW)|Published Papers (DIW)]]''' page.</span>
<span style="color: red;">The information for '''Unheated or Chilled Reservoir Printing''', also known as '''Robocasting''' or '''DIW''' (Direct Ink Writing), '''SEP''' (Semisolid Extrusion Printing), '''SSE''' (Semisolid Extrusion). '''3DCP''' (3D Concrete Printing), or '''DCC''' (Digital Concrete Construction), ran too long, and has been split off to the new '''[[Published_Papers_(DIW)|Published Papers (DIW)]]''' page.</span>


== Count ==
== Count ==


661 documents as of 27 August, 2025.
671 total documents as of 30 September, 2025.


== '''Non-Traditional Manufacturing''' ==
== '''Non-Traditional Manufacturing''' ==
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== NTM, 2025 ==
== NTM, 2025 ==


* [https://advanced.onlinelibrary.wiley.com/doi/pdf/10.1002/adem.202501686 Encapsulating Laser-Induced Graphene to Preserve its Electrical Properties and Enhance its Mechanical Robustness] by a team from [https://lassonde.yorku.ca/eecs Department of Electrical Engineering and Computer Science, York University, Toronto]
* [https://advanced.onlinelibrary.wiley.com/doi/pdf/10.1002/adfm.202519702 Intrinsically Soft Printed Electronics for Digitally Augmented Human Sensing and Vision] by a team from [https://www.gonzaga.edu/ Gonzaga University], [https://www.cmu.edu/ Carnegie Mellon University]. [https://www.uc.pt/en/ University of Coimbra, Portugal], and [https://www.gatech.edu/ Georgia Institute of Technology]
* [https://commons.erau.edu/cgi/viewcontent.cgi?article=1956&context=edt Embeddable Multi-Material Wireless Micro-Sensors Utilizing Additive Manufacturing and Enhanced Microstructure] a thesis submitted to [https://daytonabeach.erau.edu/college-engineering/aerospace Aerospace Engineering program at Embry-Riddle Aeronautical University]
* [https://commons.erau.edu/cgi/viewcontent.cgi?article=1956&context=edt Embeddable Multi-Material Wireless Micro-Sensors Utilizing Additive Manufacturing and Enhanced Microstructure] a thesis submitted to [https://daytonabeach.erau.edu/college-engineering/aerospace Aerospace Engineering program at Embry-Riddle Aeronautical University]
* [https://pubs.acs.org/doi/abs/10.1021/acsanm.5c02542 Surface Air Plasma Treatment of Laser-Induced Graphene-Based Electrodes for Enhanced Electrochemical Sensing Performance] by a team from [https://lassonde.yorku.ca/ Lassonde School of Engineering, York University, Toronto]
* [https://pubs.acs.org/doi/abs/10.1021/acsanm.5c02542 Surface Air Plasma Treatment of Laser-Induced Graphene-Based Electrodes for Enhanced Electrochemical Sensing Performance] by a team from [https://lassonde.yorku.ca/ Lassonde School of Engineering, York University, Toronto]
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* [https://www.nature.com/articles/s41467-025-56140-1 Time Code for Multifunctional 3D Printhead Controls] by a team from the [https://engineering.jhu.edu/case/ Department of Civil and Systems Engineering, Johns Hopkins University]
* [https://www.nature.com/articles/s41467-025-56140-1 Time Code for Multifunctional 3D Printhead Controls] by a team from the [https://engineering.jhu.edu/case/ Department of Civil and Systems Engineering, Johns Hopkins University]
* [https://hyrel3d.com/wiki/index.php/Tranining_%26_Support RF Sensitive Sensors, Circuits, and Interconnects Using Additive Materials and Techniques] by a team from [https://www.uml.edu/engineering/electrical-computer/ Department of Electrical Engineering, University of Massachusetts Lowel] and [https://sc.devcom.army.mil/ U.S. Army DEVCOM Soldier Center]
* [https://hyrel3d.com/wiki/index.php/Tranining_%26_Support RF Sensitive Sensors, Circuits, and Interconnects Using Additive Materials and Techniques] by a team from [https://www.uml.edu/engineering/electrical-computer/ Department of Electrical Engineering, University of Massachusetts Lowel] and [https://sc.devcom.army.mil/ U.S. Army DEVCOM Soldier Center]
[[#top|Top]]


== NTM, 2024 ==
== NTM, 2024 ==

Latest revision as of 10:56, 3 October 2025

Below is a list of published works citing Hyrel equipment.

The information for Unheated or Chilled Reservoir Printing, also known as Robocasting or DIW (Direct Ink Writing), SEP (Semisolid Extrusion Printing), SSE (Semisolid Extrusion). 3DCP (3D Concrete Printing), or DCC (Digital Concrete Construction), ran too long, and has been split off to the new Published Papers (DIW) page.

Count

671 total documents as of 30 September, 2025.

Non-Traditional Manufacturing

Including:

  • 4D Printing
  • Antennas, Sensors, Batteries, Inductors, and Circuits
  • Electro-Spinning
  • Electro-Melt-Spinning
  • Engineered Living Materials (ELM)
  • Melt Electro-Writing (MEW)
  • Multiphase Direct Ink Writing (MDIW)
  • Nanostructures
  • Micro-Encapsulated Phase-Changing Materials (MEPCM)
  • Plasma Treatments
  • Printing with Embedded Fibers
  • Shape Memory Polymers
  • And combining two or more additive manufacturing methods in a single build.

NTM, 2025

Top


NTM, 2024

NTM, 2023

NTM, 2022

NTM, 2021

NTM, 2020

NTM, 2019

NTM, 2018

NTM, 2017

NTM, 2016

NTM, 2015

Unheated or Chilled Reservoir Printing (DIW, SEP, SSE, 3DCP, DCC)

Also known as Robocasting or DIW (Direct Ink Writing), SEP (Semisolid Extrusion Printing), SSE (Semisolid Extrusion). 3DCP' (3D Concrete Printing), or DCC (Digital Concrete Construction).

DIW/SEP/SSE, 2024

DIW/SEP/SSE, 2023

DIW/SEP/SSE, 2022

DIW/SEP/SSE, 2021

DIW/SEP/SSE, 2020

DIW/SEP/SSE, 2019

DIW/SEP/SSE, 2018

DIW/SEP/SSE, 2017

DIW/SEP/SSE, 2016

DIW/SEP/SSE, 2015

DIW/SEP/SSE, 2014

Heated Reservoir Printing (DPE, HME)

Also known as DPE (Direct Powder Extrusion) or HME (Hot Melt Extrusion).

DPE, HME 2024

DPE, HME 2023

DPE, HME 2022

DPE, HME 2021

DPE, HME 2020

DPE, HME 2019

DPE, HME 2018

DPE, HME 2017

Filament Printing (FFF, FDM)

Also known as FFF (Fused Filament Fabrication) or FDM (Fused Deposition Modeling).

FDM/FFF, 2024

FDM/HFF, 2023

FDM/HFF, 2022

FDM/HFF, 2021

FDM/HFF, 2020

FDM/HFF, 2019

FDM/HFF, 2018

FDM/HFF, 2017

FDM/HFF, 2016