Difference between revisions of "Published Papers"

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== NTM, 2023 ==
== NTM, 2023 ==


* [https://link.springer.com/article/10.1007/s11665-023-08979-y Surface Oxide Removal in Preparation for Controlled Liquid Metal Embrittlement] by a team from the US Army Engineer Research and Development Center (EDRC)'s [https://www.erdc.usace.army.mil/Locations/CERL/ Construction Engineering Research Laboratory] and [https://www.erdc.usace.army.mil/Locations/GSL/ Geotechnical & Structures Laboratory]
* [https://www.sciencedirect.com/science/article/pii/S0014305723005268 Vitrimer Chemistry for 4D Printing Formulation] by a team from [https://sut.ac.ir/en/ Sahand University of Technology, Iran], [https://www.ntu.ac.uk/ Nottingham Trent University, UK], and [https://www.deakin.edu.au/ Deakin University, Geelong, Australia]
* [https://www.sciencedirect.com/science/article/pii/S0014305723005268 Vitrimer Chemistry for 4D Printing Formulation] by a team from [https://sut.ac.ir/en/ Sahand University of Technology, Iran], [https://www.ntu.ac.uk/ Nottingham Trent University, UK], and [https://www.deakin.edu.au/ Deakin University, Geelong, Australia]
* [https://onlinelibrary.wiley.com/doi/pdf/10.1002/admt.202300188 Laser-Induced Graphene Electrodes for OrganicElectrochemical Transistors (OECTs)] by a team from [https://lassonde.yorku.ca/eecs/ Department of Electrical Engineering and Computer Science, Lassonde School of Engineering, York University, Toronto]
* [https://onlinelibrary.wiley.com/doi/pdf/10.1002/admt.202300188 Laser-Induced Graphene Electrodes for OrganicElectrochemical Transistors (OECTs)] by a team from [https://lassonde.yorku.ca/eecs/ Department of Electrical Engineering and Computer Science, Lassonde School of Engineering, York University, Toronto]

Revision as of 08:25, 4 October 2024

Below is a list of published works citing Hyrel equipment.

Count

486 documents as of 8 December, 2023.

Non-Traditional Manufacturing (NTM)

Including:

  • Antennas
  • Sensors
  • Inductors
  • Circuits
  • Electro-Spinning
  • Electro-Melt-Spinning
  • Melt Electro-Writing (MEW)
  • 4D Printing
  • Shape Memory Polymers
  • Nanostructures
  • Micro-Encapsulated Phase-Changing Materials (MEPCM)
  • Printing with Embedded Fibers
  • And combining two or more additive manufacturing methods in a single build.

NTM, 2024

NTM, 2023

NTM, 2022

NTM, 2021

NTM, 2020

NTM, 2019

NTM, 2018

NTM, 2017

NTM, 2016

NTM, 2015

Unheated or Chilled Reservoir Printing (DIW, SEP, SSE, 3DCP, DCC)

Also known as Robocasting or DIW (Direct Ink Writing), SEP (Semisolid Extrusion Printing), SSE (Semisolid Extrusion). 3DCP' (3D Concrete Printing), or DCC (Digital Concrete Construction).

DIW/SEP/SSE, 2023

DIW/SEP/SSE, 2022

DIW/SEP/SSE, 2021

DIW/SEP/SSE, 2020

DIW/SEP/SSE, 2019

DIW/SEP/SSE, 2018

DIW/SEP/SSE, 2017

DIW/SEP/SSE, 2016

DIW/SEP/SSE, 2015

DIW/SEP/SSE, 2014

Heated Reservoir Printing (DPE, HME)

Also known as DPE (Direct Powder Extrusion) or HME (Hot Melt Extrusion).

DPE, HME 2023

DPE, HME 2022

DPE, HME 2021

DPE, HME 2020

DPE, HME 2019

DPE, HME 2018

DPE, HME 2017

Filament Printing (FFF, FDM)

Also known as FFF (Fused Filament Fabrication) or FDM (Fused Deposition Modeling).

FDM/HFF, 2023

FDM/HFF, 2022

FDM/HFF, 2021

FDM/HFF, 2020

FDM/HFF, 2019

FDM/HFF, 2018

FDM/HFF, 2017

FDM/HFF, 2016